Korean semiconductor packager Nepes has become the world's first to commercialize fan-out panel level package (FO-PLP) technology. It will allow smartphone makers to reduce costs spent on chips, which ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, has licensed advanced packaging technology from Deca Technologies and has taken ...
The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback