Samsung plans to adopt hybrid bonding technology for its HBM4 to reduce thermals and enable an ultra-wide memory interface, the company revealed at the AI Semiconductor Forum held in Seoul, South ...

Earnings Call Insights: BE Semiconductor Industries N.V. (OTC:BESIY) Q4 2024 Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker ...

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment. The company plans ...

When the subject of hybrid bonding is brought up in the industry, the focus is often on how this technique is used to manufacture CMOS image sensors (CIS), an essential device for today’s digital ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

BE Semiconductor is a small but high-potential semiconductor equipment manufacturer with a strong market position in Die Attach. The company has great growth prospects, a healthy balance sheet and ...

Good morning, good afternoon, ladies and gentlemen, and welcome to Besi's conference call and audio webcast to discuss the company's 2025 third quarter results. You ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xperi Holding Corporation™ (NASDAQ: XPER) (“Xperi”) today announced that the company entered into a license agreement with Yangtze Memory Technologies Co., Ltd.

DELRAY BEACH, Fla., Dec. 11, 2025 /PRNewswire/ -- According to MarketsandMarkets, the global Hybrid Bonding Market is projected to reach USD 633.9 million by 2032 from USD 164.7 million in 2025, ...