The new funding will help CoolSem Technologies advance its wafer-level thermal management technology, improving heat efficiency, extending chip lifetimes, and enabling more sustainable performance in ...
Chips are now a critical resource, with rising pressure on raw materials and significant inefficiencies in heat management.
Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...
Naperville, IL - February 7, 2003 - The semiconductor industry has reached a new milestone with the creation of a 3-D silicon structure built of four silicon wafers. Tachyon Semiconductor Corporation, ...
TOKYO — Seeking to break the limitations of producing complex ICs on present processes, a startup here plans to stack chips atop one another to create 3-D circuits with advantages it claims systems-on ...
ERFURT, Germany & GRENOBLE, France--(BUSINESS WIRE)--X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient ...
Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
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