Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Micron Technology Inc. today began offering samples of a SDRAM die in wafer-level chip-scale packaging (WLCSP). The packaging process makes Micron one of the only memory manufacturers capable of ...
CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...
SAN JOSE–Integrated Packaging Assembly Corp. (IPAC) today (January 8, 2004) entered the wafer-level, chip-scale packaging market. IPAC will provide a range of packaging services, including thin-film ...
At the end of January, Advanced Chip Engineering Technology (ACE) will begin applying its WLCSP (wafer-level chip-scale package) burn-in, packaging and testing solution to 256Mbit DDR (double data ...
Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...
Mi Technovation Bhd. engages in the design, development, manufacture and sale of wafer level chip scale packaging sorting machines. It operates through the following segments: machine, spare parts, ...
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