Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Microchip has developed a single-I/O bus UNI/O EEPROM devices in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring 0.85 mm x 1.38 mm, the ...
And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before? Neither ...
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