Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE ...

FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of its ...