Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.
A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)’s ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback