The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback