Semiconductor Engineering

Interconnect Innovations In High Bandwidth Memory: Part 2

Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid ...
Seeking Alpha

Onto Innovation Advances Process Control Suite for 3D Interconnect Yields

WILMINGTON, Mass.--(BUSINESS WIRE)-- Onto Innovation Inc. (ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di ™ technology on the Dragonfly ...
Electronic Design

Flexible Interconnect Acts As A "Bus Tuner" For Wireless-Bound SoCs

Physical structures, advanced protocols, and extensive power-management capabilities all merge together on the SonicsMX. Developed by Sonics in conjunction with Texas Instruments, this suite of ...
Nasdaq

Adeia’s Pioneering Hybrid Bonding Technology Continues to Capture Attention

SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...
Network World

Myricom claims low-latency 10 Gigabit Ethernet; Peripheral cools down hot spots

It’s slow out here in server land this week, now that Sun has made its Opteron-based server announcements. About all that has crossed the ticker is news of a technology demonstration from cluster ...
EDN

Enabling next-gen Heterogeneous Integration Architecture

The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...
Semiconductor Engineering

Interconnect Innovations In High Bandwidth Memory: Part 1

The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics.