Micro-pattern of 7 µm thick TA Series formed by LDI; (a) Resist pattern (L/S = 1.0/3.0 µm; L/S = Line / Space in micro-wiring [µm]) front side; (b) Resist pattern (L/S = 1.0/3.0 µm) oblique; (c) ...

(Nanowerk News) FUJIFILM Corporation and nano-electronics research institute, imec, have demonstrated full-color organic light-emitting diodes (OLED)*1 by using their jointly-developed photoresist ...

Multi-patterning schemes such as Self-Aligned Double Patterning (SADP) and Self-Aligned Quadruple Patterning (SAQP) have been used to successfully increase semiconductor device density, circumventing ...

Semiconductors could be termed as the most extensively utilized substance in the modern century owing to their vast advantages over their counterparts. Modern computers, the transportation industry, ...

In this section, the manufacturing requirements associated with advanced semiconductor lithography are discussed. This is followed by a discussion of lithographic approaches being used or being ...

What Is Electron Beam Lithography? Electron beam lithography (EBL) is a technique for creating high-resolution patterns on a semiconductor substrate by directing a beam of electrons to selectively ...

Just as the heartbeats of today's electronic devices depend on the ability to switch the flow of electricity in semiconductors on and off with lightning speed, the viability of the "spintronic" ...

A new laser-based method to anneal thin photoresist films that are used to transfer intricate patterns onto silicon wafers is currently being trialled by semiconductor manufacturers, says a team ...

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