The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...

Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC ...

FREMONT, Calif. — After securing its leadership position in the IC-test subcontracting business, Taiwan's United Test Center Inc. (UTC) is now looking to spread its wings and conquer the ...

July 9, 2012. Multitest, a designer and manufacturer of final-test handlers, contactors, and load boards used by integrated device manufacturers (IDMs) and final test subcontractors, has announced ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...