Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...

Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...

Version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator is now available from EMA Design Automation. Version 2.0b contains over 200 time-domain simulation models for power ...