Smaller is better when it comes to sterile device package design. The EtO package design is generally either a Tyvek lidded thermoform tray, a Tyvek-poly film pouch, or, for moisture- and ...

Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.