At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
MILPITAS, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system.
Venice, Florida — The latest integrated circuit manufacturing process advances have significantly increased the number of gates on an IC, and test pattern sizes continue to grow as a result. In ...
Production delays and quality errors are a universal challenge in manufacturing. In Aerospace and defense (A&D), however, the stakes are especially high. An equipment failure or out-of-tolerance ...
A technical paper titled “In situ electrical property quantification of memory devices by modulated electron microscopy” was published by researchers at Hitachi High-Tech Corporation, KIOXIA ...
Read more about meeting the individual challenges of digital zero-defect testing and details of approaches to dealing with these challenges. The effectiveness of semiconductor manufacturing test has a ...
A project at MIT has developed a process to integrate atomic-scale defects located in thin slices of diamond, so called "artificial atoms," into photonic circuitry on a larger scale than previously ...
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