Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

A new chip-based quantum memory uses 3D-printed “light cages” to store light in atomic vapor with high precision. Quantum ...

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable ...

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...

A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Scientists have developed a groundbreaking on-chip quantum memory platform using 3D-nanoprinted hollow-core waveguides called ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...